• Tel：+49-6436-949138-0
    Home > Produkte > Aushärtungsmethoden

    Aushärtungsmethoden

    UV Härtung
    UV Härtung
    PW 1488M
    UV-curable acrylic for component encapsulation protection: good compatibility with flux, excellent moisture resistance, environmental aging, temperature punching and high and low temperature cycle performance, low shrinkage and stress during curing
    PW 1446M
    In-line UV curable acrylic gasket for sealing, potting and bonding plastic, glass, metal and FR4, as well as protecting sensitive components on PCB/FPCB, good flexibility and high elongation, good waterproof performance
    CH 9000
    UV curable acrylic for sealing, potting and bonding of plastics, glass, metal and FR4, as well as protecting sensitive components on PCB/FPCB, low UV curing energy, excellent moisture and high temperature resistance, excellent mechanical impact resistance
    NOBELPLA 3036HV
    UV-curable acrylic for sealing, potting and bonding plastics, glass, metal and FR4, as well as protecting sensitive components on PCBs/FPCBs, excellent moisture resistance, easy to apply in a variety of ways
    NOBELPLA 3086
    UV curing for encapsulation of FPC and electronic components, excellent moisture resistance, easy to apply in a variety of ways
    NOBELPLA 3090
    UV curing for encapsulation of FPC and electronic components, excellent moisture resistance, easy to apply in a variety of ways
    Mehr anzeigen
    Aushärtung durch Luftfeuchtigkeit
    Aushärtung durch Luftfeuchtigkeit
    N-Sil 8516W
    Thermally conductive modified silanes for thermally conductive bonding of electronic components: no organotin, excellent impact or vibration resistance, low contact thermal resistance, can be repaired
    PW 1462
    UV moisture-cured acrylic is used for sealing, potting and bonding on a variety of materials, rapid UV radiation curing, and then moisture curing to cover the shadow area, suitable flexibility and softness
    PW 2440HR(HQ)
    UV moisture curing acrylic for sealing, potting and bonding of plastics, glass, metal and FR4, as well as protecting sensitive components on PCBs/FPCBs, rapid UV curing followed by moisture curing to cover shadow parts, IBOA free
    PW 2440LR
    UV moisture curing acrylic for PC sealing and bonding on a variety of materials such as PMMA, glass, aluminum and stainless steel, rapid UV curing, followed by moisture curing to cover shadow parts, good flexibility and softness, IBOA free
    PW 2440NR(HQ)
    UV moisture-cured acrylic for bonding on a wide range of materials. Typical applications are camera modules, lens and IR filter bonding, rapid UV curing, followed by moisture curing to cover shadows, good flexibility and softness, IBOA-free
    PW 2440NR(PO)
    UV moisture-cured acrylic for bonding on a wide range of materials. Typical applications are camera modules, lens and IR filter bonding, rapid UV curing, followed by moisture curing to cover shadows, good flexibility and softness, IBOA-free
    Mehr anzeigen
    Thermische Aushärtung
    Thermische Aushärtung
    N-Sil 8352
    One-component thermosetting conductive silicone CIPG, mainly used for electromagnetic shielding and sealing: suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability
    EW 6710
    One-component heat-curing epoxy underfill: excellent resistance to mechanical shock or vibration, easy to apply in multiple ways, low viscosity and good flowability, can be repaired
    EW 6684-3
    Two-component heat-curing epoxy structural adhesive: excellent adhesion to a variety of substrates, halogen-free, excellent high temperature and humidity reliability, easy to apply in a variety of ways
    EW 6305
    One-component heat-curing epoxy structural adhesive for chip corner binding: high reliability
    CT 6010
    Heat-curing acrylic for sealing, potting and bonding on a variety of materials such as plastics, meets biocompatibility requirements: thixotropic properties and controlled flowability, high SIR, non-sticky surface
    CT 6020
    Heat-curing acrylic for sealing, potting and bonding of a variety of materials, thixotropic properties and controllable fluidity, non-sticky surface, high SIR, excellent temperature stamping resistance
    Mehr anzeigen
    2-Komponenten Produkte
    2-Komponenten Produkte
    AW 2902
    Two-component solvent-free acrylic structural adhesive: low odor, excellent high temperature resistance, fast curing at room temperature, no special surface pretreatment required
    AW 2928MT
    Two-component solvent-free acrylic structural adhesive: Excellent bond strength, excellent toughness and impact resistance, no flow
    AW 2928M
    Two-component solvent-free acrylic structural adhesive: excellent bond strength, excellent toughness and impact resistance, no flow
    N-PU 5901
    Two-component polyurethane structural adhesive: excellent adhesion to a variety of substrates, halogen-free, excellent high temperature and humidity reliability, easy to apply in a variety of ways
    EW 6684-3
    Two-component heat-curing epoxy structural adhesive: excellent adhesion to a variety of substrates, halogen-free, excellent high temperature and humidity reliability, easy to apply in a variety of ways
    AW 2901
    Two-component acrylic for structural bonding of a variety of materials such as plastics, metals, ceramics, and wood, low odor, excellent high temperature resistance, fast curing at room temperature, no special surface treatment
    Mehr anzeigen
    Sonstige Produkte
    Sonstige Produkte
    N-Sil 8630
    One-component thermal grease: high thermal conductivity, low modulus and mechanical stress, easy to apply and remove with alcohol or acetone, high temperature resistance
    N-Sil 8112TC
    Room temperature vulcanized silicone sealant for CCM/FPC protection, with 80°C specific process discoloration function for process check, fast curing at room temperature, thixotropic performance and controllable flowability, excellent impact or vibration resistance, color from purple red to white
    N-Sil 8113
    Room temperature vulcanized silicone sealant for board level sealing, PCB component protection, FPC reinforcement, speaker shell sealing, etc., fast curing at room temperature, excellent adhesion to a variety of substrates, excellent electrical properties, excellent moisture resistance, high temperature and chemical properties
    N-Sil 8113B
    Room temperature vulcanized silicone sealant for board level sealing, PCB component protection, FPC reinforcement, speaker shell sealing, etc., fast curing at room temperature, excellent adhesion to a variety of substrates, excellent electrical properties, excellent moisture resistance, high temperature and chemical properties
    N-Sil 8113XY
    Room temperature vulcanized silicone sealant for board level sealing, PCB component protection, FPC reinforcement, speaker shell sealing, etc., fast curing at room temperature, excellent adhesion to a variety of substrates, excellent electrical properties, excellent moisture resistance, high temperature and chemical properties
    N-Sil 8115B-L
    Room temperature vulcanized silicone sealant for waterproofing, good flexibility and softness, low viscosity and good fluidity, excellent electrical properties, good sealing and reflux resistance
    Mehr anzeigen
    Über Colltech

    Über uns

    Globaler Fußabdruck

    Impressum

    Nachrichten

    Aktivitäten

    Datenschutz

    Anwendungen

    Unterhaltungselektronik

    Automobil

    Halbleiter

    Weitere Geschäftsfelder

    Produkte

    Chemische Basis

    Aushärtungsmethoden

    Funktionen

    Ausrüstungspartner

    Partnerschaften

    Kontakt

    Finden sie uns

    Beratung

    LinkedIn of Colltech

    Copyright © CollTech Technology Impressum Datenschutz

    Cookie settings
    Website use cookie just to improve the user experience. Please allow to use cookies and continue to visit the website. You can check out our Privacy Policy to read more about our Cookie policy.

    Impressum