CollTech to Present Material Solutions for FPCs at TechConnect World Innovation Conference and Expo

For over 20 years the TechConnect World Innovation Conference and Expo has connected top applied research and early-stage innovations from universities, labs, and startups with industry end-users and prospectors. The 2023 event will be held in Washington, DC, Gaylord National Harbor, June 19-21, 2023. It includes more than 35 world-class technical symposium, is the world's largest and longest running nanotechnology event.

CollTech is hornored to be invited to present “How to Make Flexible Printed Circuits More Reliable”. Our Marketing Director, Ms. Amandine YU will introduce the market trend as well as CollTech's material solutions for FPCs manufacturing at the Printed & Flexible Electronics Symposium.

Welcome to join the world's brightest researchers, innovators, and technology prospectors together with us.

Learn more about the symposium Link Here, or please contact with CollTech representitives.