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    Strukturklebstoffe
    Strukturklebstoffe
    AW 2902
    Two-component solvent-free acrylic structural adhesive: low odor, excellent high temperature resistance, fast curing at room temperature, no special surface pretreatment required
    AW 2928MT
    Two-component solvent-free acrylic structural adhesive: Excellent bond strength, excellent toughness and impact resistance, no flow
    AW 2928M
    Two-component solvent-free acrylic structural adhesive: excellent bond strength, excellent toughness and impact resistance, no flow
    PW 1488M
    UV-curable acrylic for component encapsulation protection: good compatibility with flux, excellent moisture resistance, environmental aging, temperature punching and high and low temperature cycle performance, low shrinkage and stress during curing
    N-PU 5901
    Two-component polyurethane structural adhesive: excellent adhesion to a variety of substrates, halogen-free, excellent high temperature and humidity reliability, easy to apply in a variety of ways
    EW 6684-3
    Two-component heat-curing epoxy structural adhesive: excellent adhesion to a variety of substrates, halogen-free, excellent high temperature and humidity reliability, easy to apply in a variety of ways
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    Verguss und Verkapselung
    Verguss und Verkapselung
    CT 6010
    Heat-curing acrylic for sealing, potting and bonding on a variety of materials such as plastics, meets biocompatibility requirements: thixotropic properties and controlled flowability, high SIR, non-sticky surface
    CT 6020
    Heat-curing acrylic for sealing, potting and bonding of a variety of materials, thixotropic properties and controllable fluidity, non-sticky surface, high SIR, excellent temperature stamping resistance
    CT 6020H
    Heat-curing acrylic for sealing plastics, glass, metals and FR4, as well as protecting sensitive components on PCBs/FPCBs, thixotropic properties and controlled flowability
    CT 6020HV
    Heat-curing acrylic for LCD module ITO/COG coating and LED sealing, excellent temperature and impact resistance
    PW 1446M
    In-line UV curable acrylic gasket for sealing, potting and bonding plastic, glass, metal and FR4, as well as protecting sensitive components on PCB/FPCB, good flexibility and high elongation, good waterproof performance
    CH 9000
    UV curable acrylic for sealing, potting and bonding of plastics, glass, metal and FR4, as well as protecting sensitive components on PCB/FPCB, low UV curing energy, excellent moisture and high temperature resistance, excellent mechanical impact resistance
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    Thermisch leitende Klebstoffe
    Thermisch leitende Klebstoffe
    N-Sil 8516W
    Thermally conductive modified silanes for thermally conductive bonding of electronic components: no organotin, excellent impact or vibration resistance, low contact thermal resistance, can be repaired
    N-Sil 8630
    One-component thermal grease: high thermal conductivity, low modulus and mechanical stress, easy to apply and remove with alcohol or acetone, high temperature resistance
    N-Sil 8608D
    Thermal grease for thermal management of heat sinks, memory and chipsets, power transistor CPUs, etc., suitable thermal conductivity, easy to apply and remove with alcohol or acetone, high temperature resistance, no drying problems, low viscosity
    N-Sil 8610
    Thermal grease for thermal management of heat sinks, memory and chipsets, power transistor CPUs, etc., suitable thermal conductivity, easy to apply and remove with alcohol or acetone, high temperature resistance, no drying problems, low viscosity
    N-Sil 8630
    Thermal grease, used for thermal management of heat sinks, memory and chipsets, power transistor CPUs, etc., high thermal conductivity, low modulus and mechanical stress, easy to apply and remove with alcohol or acetone, high temperature resistance
    N-Sil 8532
    Thermally conductively modified silanes for thermally conductive bonding of electronic components, organotin free, excellent impact or vibration resistance, low contact thermal resistance, reworkable
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    Elektrisch leitende Klebstoffe
    Elektrisch leitende Klebstoffe
    N-Sil 8352
    One-component thermosetting conductive silicone CIPG, mainly used for electromagnetic shielding and sealing: suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability
    N-Sil 8356
    Conductive silica gel for electromagnetic shielding CIPG, suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability
    N-Sil 8352
    Conductive silica gel for electromagnetic shielding CIPG, suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability
    N-Sil 8358
    Conductive silica gel for electromagnetic shielding CIPG, suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability
    N-Sil 8462
    Conductive silica gel, used for electromagnetic shielding CIPG, curable at room temperature, excellent electromagnetic shielding performance, excellent sealing
    N-Sil 8391
    Conductive silica gel, used for conductive bonding, easy to apply glue in a variety of ways, high bonding strength, good reflux resistance, low volume resistivity
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    Sonstige Produkte
    Sonstige Produkte
    EW 6710
    One-component heat-curing epoxy underfill: excellent resistance to mechanical shock or vibration, easy to apply in multiple ways, low viscosity and good flowability, can be repaired
    N-Sil 8115B-L
    Room temperature vulcanized silicone sealant for waterproofing, good flexibility and softness, low viscosity and good fluidity, excellent electrical properties, good sealing and reflux resistance
    EW 6300
    Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, easy to apply in a variety of ways, fire resistance
    EW 6078
    Heat-curing low fill, used for CSP or BGA solder joint protection underfill, can be reworked, good compatibility with flux, good flow and fast curing, excellent resistance to mechanical stress and warm stamping
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